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Intel(R) ME TEE Library is the cross-platform access
library for Intel(R) CSME HECI interface.
Sources at: https://github.com/intel/metee
To be used by LMS service.
Signed-off-by: Alexander Usyskin <alexander.usyskin@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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The ADAPTIVE Communication Environment library.
Sources: http://download.dre.vanderbilt.edu/
To be used by LMS service.
Signed-off-by: Alexander Usyskin <alexander.usyskin@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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This reverts commit 946c15720eea1e8e5b4640c7238d2aa60e248342.
Revert part of commit to keep bbappend file. This file
is required to build and deploy EFI boot stub
Signed-off-by: Naveen Saini <naveen.kumar.saini@intel.com>
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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The platform isn't supported anymore and this isn't tested as a result
with recent kernels supported.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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Changes from release notes:
- Support of KBL-G with discrete GPU
- Fast removal of any cooling action which was applied once
temperature is normal
- Android support
- Add Hot trip point, which when reached just calls "suspend"
- Adding new tag "DependsOn" which enable/disable trip based on some other trip
- Polling interval can be configured via thermal xml config
- Per trip PID control
- Simplify RAPL cooling device
Also remove upstreamed patches and add a change to fix build failures.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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Obsolete and not being maintained anymore.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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Looks for the wrong device node, startup script fails among other
issues and as a result, doesn't work.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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It's not being maintained anymore and the scripts have not been kept in
sync with upstream for quite some time.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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From README:
- Workwround for platform with invalid thermal table
- Error printing for RAPL constraint sysfs read on failure
- thermal-conf.xml.auto can be read from /etc/thermald, which allows user to modify
generated thermal-conf.xml from /var/run/thermald and copy to /etc/thermald
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
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The code hasn't been touched for over 4 years. Its also unlikely to have
been used much if at all considering our previous lack of EFI boot
partition support.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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With the EFI image enhancements, installing to boot allows us to easily
use RMC with the new wic images.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Give it an RPROVIDES rmc-boot so that EFI_PROVIDER rmc-boot can be used
as an install target. RDEPENDS on rmc-db to satisfy its runtime
dependencies. Also add python snippet to set its IMAGE/IMAGE_PREFIX
target for when its chosen as EFI_PROVIDER.
These changes let it work well with the new wks.in file, where
previously it couldn't work with wic at all.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Patch changes:
* 0001-sd-boot-Link-RMC-library-into-bootloader-and-stub.patch removed
because make is no longer used.
* 0001-sd-boot-stub-check-LoadOptions-contains-data.patch removed because
it was accepted upstream.
* 0001-partially-revert-sd-boot-stub-Obtain-PE-section-offs.patch added to
support RMC functionality. Upstream removed a snippet that found the
root directory because they didn't need it anymore, but RMC does.
* 0002-sd-boot-fix-RMC-compatibility-with-systemd-boot-and-.patch added
to support building with meson instead of make.
* Others refreshed
inc file changes:
* Don't commit pin, we can maintain these patches OK for now
* EXTRA_OEMAKE -> EXTRA_OEMESON, and removed some superfluous options
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Fix the bbappend file to suit the latest systemd version.
As systemd has now dropped autotools support, using ninja
instead of make in do_compile.
Signed-off-by: Chen Qi <Qi.Chen@windriver.com>
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Correct license name is GPLv2.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Including a non-existant .inc doesn't cause errors, so just move the
systemd-boot.inc file into the main bbappend. This avoids rebuilding the
package without our changes should grub-efi be the EFI_PROVIDER and we
build systemd-boot, while keeping the RMC changes when rmc-boot is the
EFI_PROVIDER.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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systemd-boot shouldn't be stuck on a certain commit just because RMC is.
This effectively upgrades our systemd-boot version from v232 to v234. We
also get to drop a patch that was accepted upstream.
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Updated version with patches to ensure thermald with musl and x32.
Signed-off-by: Anuj Mittal <anuj.mittal@intel.com>
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Signed-off-by: Saul Wold <sgw@linux.intel.com>
Signed-off-by: California Sullivan <california.l.sullivan@intel.com>
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Remove the concept of the common directory and move all the recipes-* dirs
to the top level as a normal layer would be. layer.conf is updated appropriately
Signed-off-by: Saul Wold <sgw@linux.intel.com>
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Alexander Usyskin
Naveen Saini
Anuj Mittal
California Sullivan
Chen Qi
Saul Wold