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Clean up the examples by adding newline separators, moving 'reg'
properties after 'compatible' and dropping unused labels.
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-3-johan+linaro@kernel.org
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The ADC Thermal Monitor is part of an SPMI PMIC, which in turn sits on
an SPMI bus.
Fixes: db03874b8543 ("dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindings")
Fixes: e8ffd6c0756b ("dt-bindings: thermal: qcom: add adc-thermal monitor bindings")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-2-johan+linaro@kernel.org
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Add a binding for D1/T113s thermal sensor controller.
Signed-off-by: Maxim Kiselev <bigunclemax@gmail.com>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231217210629.131486-2-bigunclemax@gmail.com
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Document the critical-action property to describe the thermal action
the OS should perform after the critical temperature is reached.
The possible values are "shutdown" and "reboot".
The motivation for introducing the critical-action property is that
different systems may need different thermal actions when the critical
temperature is reached.
For example, in a desktop PC, it is desired that a shutdown happens
after the critical temperature is reached.
However, in some embedded cases, such behavior does not suit well,
as the board may be unattended in the field and rebooting may be a
better approach.
The bootloader may also benefit from this new property as it can check
the SoC temperature and in case the temperature is above the critical
point, it can trigger a shutdown or reboot accordingly.
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231129124330.519423-1-festevam@gmail.com
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Document the Temperature Sensor (TSENS) on the SM8650 Platform.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231128-topic-sm8650-upstream-bindings-tsens-v3-1-54179e6646d3@linaro.org
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Add the missing 'thermal-sensor-cells' property which is required for
every thermal sensor as it's used when using phandles.
And add the thermal-sensor.yaml reference.
In fact, it was a careless mistake when submitting the driver that
caused it to not work properly. So the fix is necessary, although it
will result in the ABI break.
Fixes: 72684d99a854 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/6d69362632271ab0af9a5fbfa3bc46a0894f1d54.1700817227.git.zhoubinbin@loongson.cn
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This helps validating DTS files. Introduced changes:
1. Improved title
2. Simplified description (dropped "This describes the device tree...")
3. Dropped undocumented "reset-names" from example
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231117052214.24554-1-zajec5@gmail.com
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This property is defined in thermal-sensor.yaml. Reference this file and
constraint '#thermal-sensor-cells' to 0 for imx-thermal.
Fixes the warning:
arch/arm/boot/dts/nxp/imx/imx6q-mba6a.dtb: tempmon:
'#thermal-sensor-cells' does not match any of the regexes: 'pinctrl-[0-9]+'
From schema: Documentation/devicetree/bindings/thermal/imx-thermal.yaml
Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231012080033.2715241-2-alexander.stein@ew.tq-group.com
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Add compatibility string for the thermal sensors on sa8775p platform.
Signed-off-by: Priyansh Jain <quic_priyjain@quicinc.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926085948.23046-2-quic_priyjain@quicinc.com
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imx8dxl also contains the SCU thermal block.
Add an entry for 'fsl,imx8dxl-sc-thermal'.
Cc: Rafael J. Wysocki <rafael@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Fabio Estevam <festevam@denx.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926122957.341094-5-festevam@gmail.com
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unevaluatedProperties on child node schemas
Just as unevaluatedProperties or additionalProperties are required at
the top level of schemas, they should (and will) also be required for
child node schemas. That ensures only documented properties are
present for any node.
Add unevaluatedProperties as needed, and then add any missing properties
flagged by the addition.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230926164500.101593-1-robh@kernel.org
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Add compatible string for mt7988 lvts application processor.
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230922055020.6436-2-linux@fw-web.de
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Amit Kucheria has not been participating in kernel development in any
way or form for quite some time, so it is not useful to list him as a
designated reviewer for the thermal subsystem or as the thermal zone DT
binding maintainer.
Remove him from the THERMAL entry in MAINTAINERS and list Daniel Lezcano
as the new thermal zone DT binding maintainer.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly updates of thermal control drivers for ARM platforms,
new thermal control support for Loongson-2 and a couple of core
cleanups made possible by recent changes merged previously.
Specifics:
- Check if the Tegra BPMP supports the trip points in order to set
the .set_trips callback (Mikko Perttunen)
- Add new Loongson-2 thermal sensor along with the DT bindings (Yinbo
Zhu)
- Use IS_ERR_OR_NULL() helper to replace a double test on the TI
bandgap sensor (Li Zetao)
- Remove redundant platform_set_drvdata() calls, as there are no
corresponding calls to platform_get_drvdata(), from a bunch of
drivers (Andrei Coardos)
- Switch the Mediatek LVTS mode to filtered in order to enable
interrupts (Nícolas F. R. A. Prado)
- Fix Wvoid-pointer-to-enum-cast warning on the Exynos TMU (Krzysztof
Kozlowski)
- Remove redundant dev_err_probe(), because the underlying function
already called it, from the Mediatek sensor (Chen Jiahao)
- Free calibration nvmem after reading it on sun8i (Mark Brown)
- Remove useless comment from the sun8i driver (Yangtao Li)
- Make tsens_xxxx_nvmem static to fix a sparse warning on QCom tsens
(Min-Hua Chen)
- Remove error message at probe deferral on imx8mm (Ahmad Fatoum)
- Fix parameter check in lvts_debugfs_init() with IS_ERR() on
Mediatek LVTS (Minjie Du)
- Fix interrupt routine and configuratoin for Mediatek LVTS (Nícolas
F. R. A. Prado)
- Drop unused .get_trip_type(), .get_trip_temp() and .get_trip_hyst()
thermal zone callbacks from the core and rework the .get_trend()
one to take a trip point pointer as an argument (Rafael Wysocki)"
* tag 'thermal-6.6-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (29 commits)
thermal: core: Rework .get_trend() thermal zone callback
thermal: core: Drop unused .get_trip_*() callbacks
thermal/drivers/tegra-bpmp: Check if BPMP supports trip points
thermal: dt-bindings: add loongson-2 thermal
thermal/drivers/loongson-2: Add thermal management support
thermal/drivers/ti-soc-thermal: Use helper function IS_ERR_OR_NULL()
thermal/drivers/generic-adc: Removed unneeded call to platform_set_drvdata()
thermal/drivers/max77620_thermal: Removed unneeded call to platform_set_drvdata()
thermal/drivers/mediatek/auxadc_thermal: Removed call to platform_set_drvdata()
thermal/drivers/sun8i_thermal: Remove unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/brcstb_thermal: Removed unneeded platform_set_drvdata()
thermal/drivers/mediatek/lvts_thermal: Make readings valid in filtered mode
thermal/drivers/k3_bandgap: Remove unneeded call to platform_set_drvdata()
thermal/drivers/k3_j72xx_bandgap: Removed unneeded call to platform_set_drvdata()
thermal/drivers/broadcom/sr-thermal: Removed call to platform_set_drvdata()
thermal/drivers/samsung: Fix Wvoid-pointer-to-enum-cast warning
thermal/drivers/db8500: Remove redundant of_match_ptr()
thermal/drivers/mediatek: Clean up redundant dev_err_probe()
thermal/drivers/sun8i: Free calibration nvmem after reading it
thermal/drivers/sun8i: Remove unneeded comments
...
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Add support for generating DT nodes for PCI devices. This is the
groundwork for applying overlays to PCI devices containing
non-discoverable downstream devices.
- DT unittest additions to check reverted changesets, to test for
refcount issues, and to test unresolved symbols. Also, various
clean-ups of the unittest along the way.
- Refactor node and property manipulation functions to better share
code with old API and changeset API
- Refactor changeset print functions to a common implementation
- Move some platform_device specific functions into of_platform.c
Bindings:
- Treewide fixing of typos
- Treewide clean-up of SPDX tags to use 'OR' consistently
- Last chunk of dropping unnecessary quotes. With that, the check for
unnecessary quotes is enabled in yamllint.
- Convert ftgmac100, zynqmp-genpd, pps-gpio, syna,rmi4, and qcom,ssbi
bindings to DT schema format
- Add Allwinner V3s xHCI USB, Saef SF-TC154B display, QCom SM8450
Inline Crypto Engine, QCom SM6115 UFS, QCom SDM670 PDC interrupt
controller, Arm 2022 Cortex cores, and QCom IPQ9574 Crypto bindings
- Fixes for Rockchip DWC PCI binding
- Ensure all properties are evaluated on USB connector schema
- Fix dt-check-compatible script to find of_device_id instances with
compiler annotations"
* tag 'devicetree-for-6.6' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (64 commits)
dt-bindings: usb: Add V3s compatible string for OHCI
dt-bindings: usb: Add V3s compatible string for EHCI
dt-bindings: display: panel: mipi-dbi-spi: add Saef SF-TC154B
dt-bindings: vendor-prefixes: document Saef Technology
dt-bindings: thermal: lmh: update maintainer address
of: unittest: Fix of_unittest_pci_node() kconfig dependencies
dt-bindings: crypto: ice: Document sm8450 inline crypto engine
dt-bindings: ufs: qcom: Add ICE to sm8450 example
dt-bindings: ufs: qcom: Add sm6115 binding
dt-bindings: ufs: qcom: Add reg-names property for ICE
dt-bindings: yamllint: Enable quoted string check
dt-bindings: Drop remaining unneeded quotes
of: unittest-data: Fix whitespace - angular brackets
of: unittest-data: Fix whitespace - indentation
of: unittest-data: Fix whitespace - blank lines
of: unittest-data: Convert remaining overlay DTS files to sugar syntax
of: overlay: unittest: Add test for unresolved symbol
of: unittest: Add separators to of_unittest_overlay_high_level()
of: unittest: Cleanup partially-applied overlays
of: unittest: Merge of_unittest_apply{,_revert}_overlay_check()
...
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The old email is no longer functioning.
Fixes: 17b1362d4919 ("MAINTAINERS: Update email address")
Signed-off-by: David Heidelberg <david@ixit.cz>
Link: https://lore.kernel.org/r/20230823223622.91789-1-david@ixit.cz
Signed-off-by: Rob Herring <robh@kernel.org>
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Add the Loongson-2 thermal binding with DT schema format using
json-schema.
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-2-zhuyinbo@loongson.cn
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Convert the Tegra thermal bindings from the free-form text format to
json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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Add marvell,armada-ap807-thermal compatible for the AP807 die.
Signed-off-by: Alex Leibovich <alexl@marvell.com>
Reviewed-by: Stefan Chulski <stefanc@marvell.com>
Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/E1qA7yP-00Ea4o-FS@rmk-PC.armlinux.org.uk
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MSM8909 uses the TSENS v0.1 block similar to other SoCs like MDM9607.
Document the "qcom,msm8909-tsens" compatible in the existing schema.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-5-5eb632235ba7@kernkonzept.com
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Since the SoC compatibles must be followed by the IP version compatible
(e.g. compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1";) it is
redundant to list all the SoC compatibles again in the if statement.
It will already match the IP-version compatible.
The list has already become inconsistent since for example
"qcom,msm8939-tsens" is covered by the if statement but is not listed
there explicitly like the other SoCs.
Simplify this by dropping the redundant SoC compatibles. ipq8064 and
msm8960 are still needed because they do not have an IP-version
compatible.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-4-5eb632235ba7@kernkonzept.com
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Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Varadarajan Narayanan <quic_varada@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ec9799504fe5a141e107bb78955d8d427f00553f.1686125196.git.quic_varada@quicinc.com
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Convert the DT binding document for bcm2835-thermal from .txt to YAML.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230604121223.9625-10-stefan.wahren@i2se.com
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Qualcomm MSM8226 has tsens v0.1 block.
Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-3-matti.lehtimaki@gmail.com
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The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-2-99715746ddb1@linaro.org
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Add the TSENS v2.x controller found on QCM2290.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230516-topic-lost_tsens_bindings-v1-1-99715746ddb1@linaro.org
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Convert Qcom IOMMU, Amlogic timer, Freescale sec-v4.0, Toshiba
TC358764 display bridge, Parade PS8622 display bridge, and Xilinx
FPGA bindings to DT schema format
- Add qdu1000 and sa8775p SoC support to Qcom PDC interrupt
controller
- Add MediaTek MT8365 UART and SYSIRQ bindings
- Add Arm Cortex-A78C and X1C core compatibles
- Add vendor prefix for Novatek
- Remove bindings for stih415, sti416, stid127 platforms
- Drop uneeded quotes in schema files. This is preparation for
yamllint checking quoting for us.
- Add missing (unevaluated|additional)Properties constraints on child
node schemas
- Clean-up schema comments formatting
- Fix I2C and SPI node bus names in schema examples
- Clean-up some display compatibles schema syntax
- Fix incorrect references to lvds.yaml
- Gather all cache controller bindings in a common directory
DT core:
- Convert unittest to new void .remove platform device hook
- kerneldoc fixes for DT address of_pci_range_to_resource/
of_address_to_resource functions"
* tag 'devicetree-for-6.4-1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (46 commits)
dt-bindings: rng: Drop unneeded quotes
dt-bindings: arm/soc: mediatek: Drop unneeded quotes
dt-bindings: soc: qcom: Drop unneeded quotes
dt-bindings: i2c: samsung: Fix 'deprecated' value
dt-bindings: display: Fix lvds.yaml references
dt-bindings: display: simplify compatibles syntax
dt-bindings: display: mediatek: simplify compatibles syntax
dt-bindings: drm/bridge: ti-sn65dsi86: Fix the video-interfaces.yaml references
dt-bindings: timer: Drop unneeded quotes
dt-bindings: interrupt-controller: qcom,pdc: document qcom,qdu1000-pdc
dt-bindings: interrupt-controller: qcom-pdc: add compatible for sa8775p
dt-bindings: reset: remove stih415/stih416 reset
dt-bindings: net: dwmac: sti: remove stih415/sti416/stid127
dt-bindings: irqchip: sti: remove stih415/stih416 and stid127
dt-bindings: iommu: Convert QCOM IOMMU to YAML
dt-bindings: irqchip: ti,sci-inta: Add optional power-domains property
dt-bindings: Add missing (unevaluated|additional)Properties on child node schemas
of: address: Reshuffle to remove forward declarations
of: address: Fix documented return value of of_pci_range_to_resource()
of: address: Document return value of of_address_to_resource()
...
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Match unit-address to first reg entry.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230420072429.36255-1-krzysztof.kozlowski@linaro.org
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Update the examples to reflect a future requirement for the generic
`channel` node name on ADC channel nodes, while conveying the board name
of the channel in a label instead.
Signed-off-by: Marijn Suijten <marijn.suijten@somainline.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230410202917.247666-4-marijn.suijten@somainline.org
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Currently the dtbs_check for imx6 generates warnings like this:
['fsl,imx6sll-tempmon', 'fsl,imx6sx-tempmon'] is too long
So add them to the devicetree binding.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230410205803.45853-4-stefan.wahren@i2se.com
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Cleanup bindings dropping unneeded quotes. Once all these are fixed,
checking for this can be enabled in yamllint.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230327170233.4109156-1-robh@kernel.org
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Add a new compatible for the thermal sensor device on RK3588 SoCs.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230308112253.15659-8-sebastian.reichel@collabora.com
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schemas
Just as unevaluatedProperties or additionalProperties are required at
the top level of schemas, they should (and will) also be required for
child node schemas. That ensures only documented properties are
present.
Add unevaluatedProperties or additionalProperties as appropriate, and
then add any missing properties flagged by the addition.
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230124230228.372305-1-robh@kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
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Add the binding documentation for the thermal support on MT8365 SoC.
Signed-off-by: Fabien Parent <fparent@baylibre.com>
Signed-off-by: Amjad Ouled-Ameur <aouledameur@baylibre.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20221018-up-i350-thermal-bringup-v9-1-55a1ae14af74@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Add node lifecycle unit tests
- Add of_property_present() helper aligned with fwnode API
- Print more information on reserved regions on boot
- Update dtc to upstream v1.6.1-66-gabbd523bae6e
- Use strscpy() to instead of strncpy() in DT core
- Add option for schema validation on %.dtb targets
Bindings:
- Add/fix support for listing multiple patterns in DT_SCHEMA_FILES
- Rework external memory controller/bus bindings to properly support
controller specific child node properties
- Convert loongson,ls1x-intc, fcs,fusb302, sil,sii8620, Rockchip
RK3399 PCIe, Synquacer I2C, and Synquacer EXIU bindings to DT
schema format
- Add RiscV SBI PMU event mapping binding
- Add missing contraints on Arm SCMI child node allowed properties
- Add a bunch of missing Socionext UniPhier glue block bindings and
example fixes
- Various fixes for duplicate or conflicting type definitions on DT
properties"
* tag 'devicetree-for-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (66 commits)
dt-bindings: regulator: Add mps,mpq7932 power-management IC
of: dynamic: Fix spelling mistake "kojbect" -> "kobject"
dt-bindings: drop Sagar Kadam from SiFive binding maintainership
dt-bindings: sram: qcom,imem: document sm8450
dt-bindings: interrupt-controller: convert loongson,ls1x-intc.txt to json-schema
dt-bindings: arm: Add Cortex-A715 and X3
of: dynamic: add lifecycle docbook info to node creation functions
of: add consistency check to of_node_release()
of: do not use "%pOF" printk format on node with refcount of zero
of: unittest: add node lifecycle tests
of: update kconfig unittest help
of: add processing of EXPECT_NOT to of_unittest_expect
of: prepare to add processing of EXPECT_NOT to of_unittest_expect
of: Use preferred of_property_read_* functions
of: Use of_property_present() helper
of: Add of_property_present() helper
of: reserved_mem: Use proper binary prefix
dt-bindings: Fix multi pattern support in DT_SCHEMA_FILES
of: reserved-mem: print out reserved-mem details during boot
dt-bindings: serial: restrict possible child node names
...
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Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4H
(R8A779G0) SoC.
Unlike most other R-Car Gen3 and Gen4 SoCs, it has 4 instead of 3
sensors, so increase the maximum number of reg tuples.
Just like other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP but to the ECM.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/11f740522ec479011cc8eef6bb450603be394def.1675958665.git.geert+renesas@glider.be
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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Add LVTS thermal controllers dt-binding definition for mt8192 and mt8195.
Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230209105628.50294-3-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The msm8974 platform uses two sets of calibration data, add a special
case to handle both of them.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-4-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Allow specifying the exact calibration mode and calibration data as nvmem
cells, rather than specifying just a single calibration data blob.
Note, unlike the vendor kernel the calibration data uses hw_ids rather
than software sensor indices (to match actual tsens usage in
thermal zones).
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-3-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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When adding support for msm8976 it was thought that msm8956 would reuse
the same compat. However checking the vendor kernel revealed that these
two platforms use different slope values for calculating the calibration
data.
Add new compatible for the tsens on msm8956 SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Link: https://lore.kernel.org/r/20230101194034.831222-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
new compatible for TM7 differs from older TM5 by allowing configuring
per sensor decimation, time measurement and number of sample averaging -
unlike one configuration per entire device. This was not reflected in
the bindings, therefore comment the new compatible as incomplete as it
might change and its ABI is no stable.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20230113090107.18498-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Prior to adding dt-bindings for SoC-dependent controllers, rename the
thermal node and its parent node to the generic names in the example.
And drop a parent node of the thermal-sensor as it is not directly
necessary.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221213082449.2721-7-hayashi.kunihiko@socionext.com
Signed-off-by: Rob Herring <robh@kernel.org>
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The Devicetree bindings document does not have to say in the title that
it is a "Devicetree binding" or a "schema", but instead just describe
the hardware.
Manual updates to various binding titles, including capitalizing them.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # opp
Link: https://lore.kernel.org/r/20221216163815.522628-10-krzysztof.kozlowski@linaro.org
[robh: add trivial-devices.yaml and net/can/microchip,mcp251xfd.yaml]
Signed-off-by: Rob Herring <robh@kernel.org>
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The Devicetree bindings document does not have to say in the title that
it is a "binding", but instead just describe the hardware.
Drop trailing "bindings" in various forms (also with trailing full
stop):
find Documentation/devicetree/bindings/ -type f -name '*.yaml' \
-not -name 'trivial-devices.yaml' \
-exec sed -i -e 's/^title: \(.*\) [bB]indings\?\.\?$/title: \1/' {} \;
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
Acked-by: Matti Vaittinen <mazziesaccount@gmail.com> # ROHM
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # MMC
Acked-by: Stephen Boyd <sboyd@kernel.org> # clk
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> # input
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Hans Verkuil <hverkuil-cisco@xs4all.nl> # media
Acked-by: Sebastian Reichel <sre@kernel.org> # power
Acked-by: Viresh Kumar <viresh.kumar@linaro.org> # cpufreq
Link: https://lore.kernel.org/r/20221216163815.522628-7-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring <robh@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are updates of assorted thermal drivers, mostly for ARM
platforms, generally isolated and fairly straightforward, and the
recent Intel HFI driver fix for systems without HFI support.
Specifics:
- Avoid clearing the HFI status bit on systems without HFI support
which triggers unchecked MSR access errors (Srinivas Pandruvada)
- Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
Weiss, Neil Armstrong)
- Use devm_platform_get_and_ioremap_resource on the ST platform to
group two calls into a single one (Minghao Chi)
- Use GENMASK instead of bitmaps and validate the temperature after
reading it in the imx8mm_thermal driver (Marcus Folkesson)
- Convert generic-adc-thermal to DT schema (Rob Herring)
- Fix debug print message with inverted logic in the k3_j72xx_bandgap
driver (Keerthy)
- Fix memory leak on thermal_of_zone_register() failure (Ido
Schimmel)
- Add support for IPQ8074 in the tsens thermal driver along with the
DT bindings (Robert Marko)
- Fix and rework the debugfs code in the tsens driver (Christian
Marangi)
- Add calibration and DT documentation for the imx8mm driver (Marek
Vasut)
- Add DT bindings and compatible for the Mediatek SoCs mt7981 and
mt7983 (Daniel Golle)
- Don't show an error message if it happens at probe time while it
will be deferred on the QCom SPMI ADC driver (Johan Hovold)
- Add HWMon support for the imx8mm board (Alexander Stein)
- Remove pointless include from the power allocator governor
(Christophe JAILLET)
- Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
(Krzysztof Kozlowski)
- Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)
- Demote error log of thermal zone register to debug in the tsens
QCom driver (Manivannan Sadhasivam)
- Consolidate the the efuse values and the errata handling in the TI
Bandgap driver (Bryan Brattlof)
- Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
bindings (Lad Prabhakar)
- Fix the irq handler return value in the LMh driver (Bjorn
Andersson)
- Delete empty platform remove callback from imx_sc_thermal (Uwe
Kleine-König)"
* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
thermal/drivers/imx_sc_thermal: Drop empty platform remove function
thermal/drivers/qcom/lmh: Fix irq handler return value
dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
dt-bindings: thermal: k3-j72xx: elaborate on binding description
thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
thermal/drivers/qcom: Demote error log of thermal zone register to debug
thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
thermal/core/power allocator: Remove a useless include
thermal/drivers/imx8mm: Add hwmon support
thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
thermal/drivers/imx: Add support for loading calibration data from OCOTP
...
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The Qualcomm SM8550 platform has three instances of the tsens block,
add a compatible for these instances.
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20221114-narmstrong-sm8550-upstream-tsens-v1-0-0e169822830f@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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The TSU block on the RZ/Five SoC is identical to one found on the RZ/G2UL
SoC. "renesas,r9a07g043-tsu" compatible string will be used on the
RZ/Five SoC so to make this clear, update the comment to include RZ/Five
SoC.
No driver changes are required as generic compatible string
"renesas,rzg2l-tsu" will be used as a fallback on RZ/Five SoC.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20221115121629.1181667-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Only some of TI's J721E SoCs will need a eFuse register range mapped to
determine if they're affected by TI's i2128 erratum. All other SoC will
not need this eFuse range to function properly
Update the bindings for the k3_j72xx_bandgap thermal driver so other
devices will only need two register ranges
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-7-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Elaborate on the function of this device node as well as some of the
properties this node uses.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
|
Johan Hovold
Maxim Kiselev
Fabio Estevam
Neil Armstrong
Binbin Zhou
Rafał Miłecki
Alexander Stein
Priyansh Jain
Rob Herring
Frank Wunderlich
Rafael J. Wysocki
Linus Torvalds
David Heidelberg
Yinbo Zhu
Thierry Reding
Alex Leibovich
Stephan Gerhold
Praveenkumar I
Stefan Wahren
Matti Lehtimäki
Konrad Dybcio
Krzysztof Kozlowski
Marijn Suijten
Sebastian Reichel
Fabien Parent
Geert Uytterhoeven
Balsam CHIHI
Dmitry Baryshkov
Kunihiko Hayashi
Lad Prabhakar
Bryan Brattlof